CIN::APSE^® is a solderless z-axis interconnect technology that offers exceptional mechanical and electrical performance. CIN::APSE^® is a proven technology that has a pedigree of providing reliable solutions to some of the most demanding applications. Custom made to meet your specific needs, CIN::APSE^® utilizes a multipoint contact that can be as small as .8mm in height, comes in 1mm centers, and can handle signal frequencies greater than 20 GHz.

The key to this high performance technology is the CIN::APSE^® button-contact. The contacts are made by randomly winding gold plated molybdenum or tungsten wire into a cylindrical button. The buttons are then loaded(stitched) into a custom molded insulator configured to the exact requirements of the application. Cinch's patented hourglass shaped button-hole allows the button to float and, therefore, stay in contact even under extreme Thermal Expansion(TCE) mismatch between mated substrates.

Unlike other z-axis technologies, such as elastomeric connectors, CIN::APSE^® buttons have a high modulus of elasticity which means they can be compressed thousands of times without taking a compression set. CIN::APSE^® buttons are also very lightweight and thermally stable which makes them extremely resistant to intermittent signals caused by shock/vibration or thermal cycling.