 |
High
signal speed capability enabling frequencies greater
than 20 GHz. |
|
Z-Axis,
solderless, compression mount interconnect system. |
|
Applications
include production Land Grid Array (LGA) integrated
circuit sockets, flex circuit to PCB, and parallel PCB
to PCB interconnections. |
|
Provides
solutions to many of the problems associated with through
hole and surface mount soldered technology. |
|
Enables
upgrade and system maintenance strategies. |
|
Available
in custom I/O counts to over 1,000 as well as offering
unique contact patterns that facilitate shortening of
signal paths. |
|
Offers
low profile capabilities with compressed signal path
length as short as 0.8 mm. |
|
Contact
centerline spacing of 1mm or greater. |
|
Excellent
reliability in commercial, military, and aerospace applications.
|
|
Application
can result in lower installed and system maintenance
costs. |
