CIN::APSE^® can be used in almost any application where you need a highly reliable interconnect between two parallel surfaces. Common applications include:

	Chip Package-to-Board (commonly called LGA - Land Grid Array)
	Board-to-Board
	Flex-to-Board
	Component-to-Board

CIN::APSE^® connectors are commonly used in a wide variety of markets such as:

	High End Computers (Servers, Workstations, Super Computers, ATE)
	Mil/Aero (RF Antennas, missile guidance, satellites, SEM-E modules)
	Telecommunications (cell phones, portable devices, high speed RF coax, Fiber Optic Transceivers)
	Automotive (sensors, ECU attach)

CIN::APSE^® is especially well suited for high speed digital or RF applications. Depending on the configuration, CIN::APSE^® can handle 26 Ghz signals with less than 3db of loss. Validating independent test reports and customer written white papers are available.