|
Here
are some guidelines to follow when layingh out your PCB,
flex circuit, chip package or MCM.
| |
.020"
dia.
button
|
.040"
dia. button |
| Characteristics |
Button
Only |
Button
/ Plunger |
Plunger / Button / Plunger |
Button / Spacer / Button |
Button
Only |
Pad
Size
(min. dia.) |
.030" |
.030" |
.020" |
.030" |
.060" |
| Minimum
Center Spacing |
1mm |
.050" |
.050" |
.050" |
.070" |
Circuit
Resistant
(milli-Ohms) |
10-15 |
30-35 |
45-50 |
40-45 |
5-10 |
Inductance
(nano-Henry) |
<1 |
<1 |
<2 |
<1 |
<1 |
| Min.
Compression Force/button |
2
oz. |
2
oz. |
2
oz. |
4
oz. |
4
oz. |
| Current
Carrying Capacity |
1-3
A |
1-3
A |
1-3
A |
1-3
A |
3-5
A |
| Contact
Travel |
up
to .010" |
up
to .010" |
up
to .010" |
up
to .020" |
up
to .012" |
Pad
Plating:
|
20µin.
Au over 50µin. Ni if multiple cycles are needed
(flash Au for single
mate) |
| In-pad
vias: |
<
half the diameter of the button |
| PCB
Flatness: |
.003 in./in. |
| Pad
true position: |
<.005"
|
| Compression
System Design |
As
stated before, CIN::APSE® is a solderless
connector technology, which relies on compression to make
contact between components. Therefore, design of a proper
compression system for the connector is very important.
The compression system must take into account the effects
of the following: PCB thickness, connector thickness, number
and spacing of buttons, and flatness of the mating surfaces.
Use
the common example listed below as a base of reference for
your designs.
 |
For
a .062" thick PCB mating to a .020" dia. button-only
CIN::APSE® connector on .050" centers,
you will need a locking device every 1.5 inches. |
|
If
planarity cannot be of achieved, a stiffener plate must
be attached to the opposite side of the PCB to limit
substrate bow. |
|
The
plate should be of suitable material and thickness to
fit the application. |
Cinch
has many years of experience in designing compression systems
with CIN::APSE®. We can help optimize a compression
system to meet your specific application.
| Button
Range* |
ø
Available
Pitch (mm) |
ø 0.4mm
0.8 |
ø 0.5mm
1.27 |
ø 1mm
2 |
ø 2mm
4 |
| Current
carrying capacities |
1A |
3A |
4A |
15A |
| Performance
Characteristics * |
| Characteristics |
Button
only |
Button/
Plunger |
Plunger/
Button/ Plunger |
Button
only |
| Contact
resistance |
<15
m |
<35
m |
<50
m |
<5
m |
| Inductance |
<1
nH |
<1
nH |
<2
nH |
<1
nH |
| Current
carrying capacity |
3A |
1.5A |
1A |
4A |
| Insulation
resistance |
20000
M |
20000
M |
20000
M |
20000
M |
| Dielectric
withstanding voltage |
600V |
600V |
600V |
600V |
| Duribility |
25000
cycles |
25000
cycles |
25000
cycles |
25000
cycles |
| Vibration |
No
cut off > 20 ns @ 55 g 10/2 kHz |
| Shock |
No
cut off > 20 ns @ 500 g/1 ms |
| Temperature
Range |
-55
to + 200 oC (LCP insulator) |
| Industrial
atmosphere |
4
days, H2S, SO, 40 oC, 75% R.H. |
| High
frequency capability |
Up
to 20 GHz |
Up
to 2 GHz |
|
|
| Technical
Advice for CIN::APSE interface, application guide* |
1.
PCB Layout:
1.1 Alignment accuracy:
A
ø 0.5 mm button requires at least a 0.84 mm ø
pad
A ø 1 mm button requires at least a 1.4 mm ø
pad
A plunger requires at least a 0.23 mm ø pad
1.2
Pad material:
Contact
area must be gold plated. A 0.76 µm nickel is suggested
if mating cycles are involved. For socket application
or one time connections, flash gold is sufficient.
1.3
Pitch:
The
minimum pitch between the contacts is 1mm with a ø
0.5 mm contact. Standard pitch is 1.27mm
1.4
Planarity:
|
The
CIN::APSE assembly force is 0.7 N to 1.7 N per position. |
|
The
substrate should not go out of shape more than 0.1mm
between locking position. |
|
With
a 1.6mm thick PCB, a locking position is suggested at
least each 40mm |
|
If
the planarity cannot be acheived, a stiffner must be
placed behind the substrate |
|
If
the substrate is coated, the coating should not be thicker
than the pad thickness under the button board. |
1.5
Vias:
Through
holes should generally be placed out of the contact area.
2.
Button board thickness:
The minimum standard is 0.79 mm
The thickness tolerance is ± 0.03 mm for a component
interface and ± 0.05 mm for a stacking connector.
*Please,
consider the above CIN::APSE performance as example and
should be confirmed for your configuration.
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